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Sweden – Industrial machinery – Deep Reaction Ion Etcher (DRIE)

Sweden · TED (Tenders Electronic Daily)

Buyer
Uppsala universitet
Country
Sweden
Value
1 SEK
Published
2026-10-12
Deadline
2026-11-10
Type
cn-standard
Status
Open to bid
Category
CPV 42000000
View original notice

Description

Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning.

The buyer's description as published on TED (Tenders Electronic Daily). The full notice is at the source.

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About this record

This notice was published via TED (Tenders Electronic Daily) and indexed automatically. Figures and dates are reproduced as published at source; always confirm against the original before acting on a deadline.

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